Vertex Standard VX-7R Bedienungsanleitung

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Seitenansicht 0
1
Specification ............................................................................................................................................ 2
Exploded View & Miscellaneous Parts .............................................................................................4
Block Diagram ........................................................................................................................................ 5
Interconnection Diagram ...................................................................................................................... 6
Circuit Description................................................................................................................................ 7
Alignment .............................................................................................................................................. 11
Board Unit (Schematics, Layouts & Parts)
RF Unit ............................................................................................................................................................................. 19
AF Unit ............................................................................................................................................................................ 33
CNTL Unit ....................................................................................................................................................................... 45
VCO Unit ......................................................................................................................................................................... 59
©2003 VERTEX STANDARD CO., LTD. EH009M90B
Technical Supplement
VX-7R
50/144/430 MHz Triple-Band
Heavy Duty Submersible Transceiver
Introduction
This manual provides the technical information necessary for servicing
the VX-7R 50/144/430 MHzTriple-Band Heavy Duty Submersible Trans-
ceiver.
Servicing this equipment requires expertise in handing surface-mount
chip components. Attempts by non-qualified persons to service this
equipment may result in permanent damage not covered by the war-
ranty, and may be illegal in some countries.
Two PCB layout diagrams provided for each double-sided board in
this transceiver. Each side of the board is referred to by the type of the
majority of components installed on that side ("Side A" or "Side B"). In
most cases one side has only chip components, and the other has either
a mixture of both chip and leaded components (trimmers, coils, electro-
lytic capacitors, ICs, etc.), or leaded components only.
While we believe the information in this manual to be correct, VER-
TEX STANDARD assumes no liability for damage that may occur as a
result of typographical or other errors that may be present. Your coop-
eration in pointing out any inconsistencies in the technical information
would be appreciated.
Contents
DW
VERTEX STANDARD CO., LTD.
4-8-8 Nakameguro, Meguro-Ku, Tokyo 153-8644, Japan
VERTEX STANDARD
US Headquarters
10900 Walker Street, Cypress, CA 90630, U.S.A.
YAESU EUROPE B.V.
P.O. Box 75525, 1118 ZN Schiphol, The Netherlands
YAESU UK LTD.
Unit 12, Sun Valley Business Park, Winnall Close
Winchester, Hampshire, SO23 0LB, U.K.
VERTEX STANDARD HK LTD.
Unit 5, 20/F., Seaview Centre, 139-141 Hoi Bun Road,
Kwun Tong, Kowloon, Hong Kong
Seitenansicht 0
1 2 3 4 5 6 ... 63 64

Inhaltsverzeichnis

Seite 1 - Contents

1Specification ...

Seite 2 - Specifications

10Circuit DescriptionPLL Frequency SynthesizerPLL IC Q1019 on the RF-UNIT consists of a data shiftregister, reference frequency divider, phase compara

Seite 3

11AlignmentIntroduction and PrecautionsThe VX-7R has been carefully aligned at the factory forthe specified performance across the specified amateurba

Seite 4

12AlignmentTest SetupSet up the test equipment as shown below for transceiv-er alignment, and apply 8.7 V DC power to the transceiver.Refer to the dra

Seite 5 - Block Diagram

13L1 Tx Power Adjustment (L1 POWER)H Transmit, and adjust the output power level for 50 mW(+50/-30 mW) by rotating the DIAL, then press the V/Mbutton.

Seite 6 - Interconnection Diagram

14Squelch Preset Threshold (THLD SQL)H Inject a –15.0 dBµ RF signal (1 kHz tone @ ±3.5 kHzdeviation), then press the V/M button, then press theMON/F b

Seite 7

15High TX Power Adjustment (L3 POWER)H Transmit, and adjust the output power level for 2.5 W(±0.2 W) by rotating the DIAL, then press the V/M but-ton.

Seite 8

16AlignmentHigh TX Power Adjustment (HI POWER)H Transmit, and adjust the output power level for 5.0 W(±0.3 W) by rotating the DIAL, then press the V/M

Seite 9

17DCS Tx Deviation Adjustment (DCS DEV)H Press the V/M button, then transmit and adjust the de-viation for 0.6 kHz (±0.1 kHz) by rotating the DIAL, th

Seite 10 - Circuit Description

18AlignmentPress the SUB button to activate the SUB band internalalignment routine.The alignment frequency will automatically be set to435.100 MHz (US

Seite 11 - Alignment

19Circuit DiagramEXT DC IN 13.8V**:RX, (**):TXRF Unit (Lot. 1~)0.2V (0V)430M RX:2.13V0.66V (0V)430M RX:2.7V0V (5.5V)50M RX:0V0V (0V)50M RX:0.45V2.25V(

Seite 12

2SpecificationsGeneralFrequency Ranges:Channel Steps:Frequency Stability:Emission Type:Antenna Impedance:Supply Voltage:Current Consumption:Operating

Seite 13

20DSide AParts LayoutSide B1SS321 (F9)(D1047)DAN222 (N)(D1006, 1007, 1008,1009, 1010, 1011,1012, 1027, 1028,1041, 1043, 1044,1063)1SS385 (09)(D1050)HN

Seite 14

21RF Unit (Lot. 4~)Circuit Diagram

Seite 15

22RF Unit (Lot. 4~)DSide AParts LayoutSide BAC123B123dacb1SS321 (F9)(D1047)DAN222 (N)(D1006, 1007, 1008,1009, 1010, 1011,1012, 1027, 1028,1041, 1043,

Seite 16

23RF UnitPCB with Components (with VCO Unit) CP7372002 USAPCB with Components (with VCO Unit) CP7372003 EXPORT(CE OFF)PCB with Components (with VCO Un

Seite 17

24RF UnitDESCRIPTIONVALUE V/W TOL. VXSTD P/NMFR’S DESIG VERS.REF.LOT.SIDELAY ADR.C 1074 CHIP CAP. 8pF 50V CH UMK105CH080DW-F K22178256 1- B b2C 1075 C

Seite 18

25RF UnitDESCRIPTIONVALUE V/W TOL. VXSTD P/NMFR’S DESIG VERS.REF.LOT.SIDELAY ADR.C 1145 CHIP CAP. 22pF 50V CH UMK105CH220JW-F K22178266 1- A C2C 1146

Seite 19 - RF Unit (Lot. 1~)

26RF UnitDESCRIPTIONVALUE V/W TOL. VXSTD P/NMFR’S DESIG VERS.REF.LOT.SIDELAY ADR.C 1221 CHIP CAP. 0.001uF 50V B UMK105B102KW-F K22178829 1- B a1C 1222

Seite 20

27RF UnitDESCRIPTIONVALUE V/W TOL. VXSTD P/NMFR’S DESIG VERS.REF.LOT.SIDELAY ADR.C 1291 CHIP CAP. 15pF 50V CH UMK105CH150JW-F K22178262 1- A A1C 1292

Seite 21 - RF Unit (Lot. 4~)

28RF UnitDESCRIPTIONVALUE V/W TOL. VXSTD P/NMFR’S DESIG VERS.REF.LOT.SIDELAY ADR.D 1032 DIODE 1SS400 TE61 G2070634 1- A B2D 1033 DIODE 1SV325(TPH3) G2

Seite 22

29RF UnitDESCRIPTIONVALUE V/W TOL. VXSTD P/NMFR’S DESIG VERS.REF.LOT.SIDELAY ADR.L 1035 M.RFC 0.072uH 2% C1608CA-72NG L1691043 1- B c2L 1036 M.RFC 0.0

Seite 23 - Parts List

3Specifications are subject to change without notice, and are guaranteed within amateur bands only.SpecificationsTransmitterRF Power Output:Modulation

Seite 24

30RF UnitDESCRIPTIONVALUE V/W TOL. VXSTD P/NMFR’S DESIG VERS.REF.LOT.SIDELAY ADR.Q 1023 FET 2SK3475(T2LVX) G3070318 19- A C1Q 1024 TRANSISTOR 2SC5226-

Seite 25

31RF UnitDESCRIPTIONVALUE V/W TOL. VXSTD P/NMFR’S DESIG VERS.REF.LOT.SIDELAY ADR.R 1043 CHIP RES. 100k 1/16W 5% RMC1/16S 104JTH J24189049 1- B c3R 104

Seite 26

32RF UnitR 1100 CHIP RES. 330 1/16W 5% RMC1/16S 331JTH J24189019 1- A C1R 1102 CHIP RES. 3.3k 1/16W 5% RMC1/16S 332JTH J24189031 1- B a3R 1103 CHIP RE

Seite 27

33Circuit DiagramAF Unit (Lot. 1~)BUSY:4.3V0.4V (0.4V)0V (0V)BUSY:0.55V0.4V (0.4V)BUSY:1.33V0V (0V)BUSY:9.2V0V (0V)12.8V (12.5V)BUSY:2.48V0V (0V)13.3V

Seite 28

34Parts LayoutTDA7233D(Q2040)BU4094BCFV-E2(Q2048)DTC143ZE (E23)(Q2039)DAP222 (P)(D2001)2SC5374 (NA)(Q2017, 2018, 2019,2031)2SJ364-R(4M)(Q2029, 2036, 2

Seite 29

35AF Unit (Lot. 3~)Circuit Diagram

Seite 30

36AF Unit (Lot. 3~)Parts LayoutDSide AAC123BSide Bdacb123TDA7233D(Q2040)BU4094BCFV-E2(Q2048)DTC143ZE (E23)(Q2039)DAP222 (P)(D2001)2SC5374 (NA)(Q2017,

Seite 31

37AF Unit (Lot. 4~)Circuit Diagram

Seite 32

38AF Unit (Lot. 4~)Parts LayoutDSide AAC123BSide Bdacb123TDA7233D(Q2040)BU4094BCFV-E2(Q2048)DTC143ZE (E23)(Q2039)DAP222 (P)(D2001)2SC5374 (NA)(Q2017,

Seite 33 - AF Unit (Lot. 1~)

39AF UnitPCB with Components CB1870001Printed Circuit Board FR008210C 1-FR008210D 3-FR008210E 4-C 2001 CHIP CAP. 33pF 50V CH UMK105CH330JW-F K22178270

Seite 34

4Exploded View & Miscellaneous PartsSUPPLIED ACCESSORIESVXSTD P/N DISCRIPTIONQ3000183 YHA-64(depending on transceiver version)Q3000185 YHA-65Q8101

Seite 35 - AF Unit (Lot. 3~)

40AF UnitC 2077 CHIP CAP. 0.0047uF 25V B GRM36B472K25PT K22148830 1- B b1C 2078 CHIP CAP. 470pF 50V B UMK105B471KW-F K22178825 1- B b1C 2079 CHIP CAP.

Seite 36

41AF UnitC 2150 CHIP CAP. 820pF 50V B GRM36B821K50PT K22178808 1- A C2C 2151 CHIP TA.CAP. 10uF 10V TEMSVA1A106M-8R K78100028 1- A C1C 2152 CHIP CAP. 0

Seite 37 - AF Unit (Lot. 4~)

42AF UnitL 2009 M.RFC 4.7uH LK1608 4R7K-T L1690688 1- A B2L 2010 M.RFC 1uH LK1608 1R0K-T L1690687 1- A A2L 2011 M.RFC 0.082uH HK1608 82NJ-T L1690527 1

Seite 38

43AF UnitR 2014 CHIP RES. 4.7k 1/16W 5% RMC1/16S 472JTH J24189033 1- A A2R 2015 CHIP RES. 1k 1/16W 5% RMC1/16S 102JTH J24189025 1- A A2R 2016 CHIP RES

Seite 39

44AF UnitR 2088 CHIP RES. 100 1/16W 5% RMC1/16S 101JTH J24189013 1- B a2R 2089 CHIP RES. 220k 1/16W 5% RMC1/16S 224JTH J24189053 1- B c3R 2090 CHIP RE

Seite 40

45Circuit DiagramEXT DC IN 13.8V**:RX, (**):TXCNTL Unit (Lot. 1~)-5.88V-4.4V-2.92V0V1.5V1.48V-4.4V-1.43V1.51V-5.88V0V0V0V0V0V0V0V0V0V0V3.0V3.0V0V(3.0V

Seite 41

46Side AParts LayoutSide BDAN222 (N)(D3014)DA221 (K)(D3015, 3016, 3017,3018, )HD6472237TF10 (USA)HD64F2238RTF13 (EXP)(Q3035)NJM3403AV(Q3018)RH5RH651A(

Seite 42

47CNTL Unit (Lot. 3~)Circuit Diagram

Seite 43

48CNTL Unit (Lot. 3~)Side AParts LayoutSide BDAC123B456dac123b456CAUTIONDanger of explosion if battery BT3001is incorrectly replaced. Replace onlywith

Seite 44

49CNTL Unit (Lot. 4~)Circuit Diagram

Seite 46

50CNTL Unit (Lot. 4~)Side AParts LayoutSide BDAC123B456dac123b456CAUTIONDanger of explosion if battery BT3001is incorrectly replaced. Replace onlywith

Seite 47 - CNTL Unit (Lot. 3~)

51CNTL UnitPCB with Components CB1871002 USAPCB with Components CB1871003 VERSION A1PCB with Components CB1871004 VERSION A2PCB with Components CB1871

Seite 48

52CNTL UnitDESCRIPTIONVALUE V/W TOL. VXSTD P/NMFR’S DESIG VERS.REF.LOT.SIDELAY ADR.C 3051 CHIP CAP. 1uF 10V F GRM39F105Z10PT K22105001 1- B c4C 3052 C

Seite 49 - CNTL Unit (Lot. 4~)

53CNTL UnitDESCRIPTIONVALUE V/W TOL. VXSTD P/NMFR’S DESIG VERS.REF.LOT.SIDELAY ADR.C 3134 CHIP CAP. 0.001uF 50V B UMK105B102KW-F K22178829 1- B b6C 31

Seite 50

54CNTL UnitDESCRIPTIONVALUE V/W TOL. VXSTD P/NMFR’S DESIG VERS.REF.LOT.SIDELAY ADR.Q 3016 FET 2SJ364-R(TX) G3703648R 1- B b4Q 3017 IC NJU7007F2-TE1 G1

Seite 51 - CNTL Unit

55CNTL UnitDESCRIPTIONVALUE V/W TOL. VXSTD P/NMFR’S DESIG VERS.REF.LOT.SIDELAY ADR.R 3034 CHIP RES. 390k 1/16W 5% RMC1/16S 394JTH J24189056 USA 2- B a

Seite 52

56CNTL UnitDESCRIPTIONVALUE V/W TOL. VXSTD P/NMFR’S DESIG VERS.REF.LOT.SIDELAY ADR.R 3094 CHIP RES. 12k 1/16W 5% RMC1/16S 123JTH J24189038 4- B a6R 30

Seite 53

57CNTL UnitDESCRIPTIONVALUE V/W TOL. VXSTD P/NMFR’S DESIG VERS.REF.LOT.SIDELAY ADR.R 3161 CHIP RES. 100k 1/16W 5% RMC1/16S 104JTH J24189049 1- B c1R 3

Seite 54

58CNTL UnitNote:

Seite 55

59Circuit DiagramParts LayoutSide A Side BDTC143ZE (E23)(Q4001, 4003, 4007)EC3H07B (G)(Q4002, 4004, 4005,4006)VCO Unit (Lot. 1~)

Seite 56

6Interconnection Diagram

Seite 57

60VCO Unit (Lot. 20~)Circuit DiagramParts LayoutSide A Side BDTC143ZE (E23)(Q4001, 4003, 4007)EC3H07B (G)(Q4002, 4004, 4005,4006)

Seite 58

61PCB with Components CB1872001Printed Circuit Board FR007830D 1-FR007830E 20-C 4001 CHIP CAP. 0.001uF 50V B UMK105B102KW-F K22178829 1- A A1C 4002 CH

Seite 59 - VCO Unit (Lot. 1~)

62L 4002 M.RFC 0.0082uH 5% C1608CA-8N2J L1691095 1- A A1L 4002 M.RFC 0.0082uH 2% C1608CB-8N2G L1691226 4- A A1L 4003 M.RFC 0.0082uH 5% C1608CA-8N2J L1

Seite 61 - VCO Unit

64EH009M90BCopyright 2003VERTEX STANDARD CO., LTD.All rights reservedNo portion of this manualmay be reproduced withoutthe permission ofVERTEX STANDAR

Seite 62

7Circuit DescriptionThe VX-7R consists of a RF-UNIT, a CNTL-UNIT andan AF-UNIT. The RF-UNIT contains the receiver front end,PLL IC, power and switchin

Seite 63

8Circuit Descriptionpassed through a band-pass filter to first mixer Q1013(2SC4915-0). Meanwhile, HF output from the VCO-UNITis amplified by Q1018 and

Seite 64 - EH009M90B

9Circuit Description(2) ModulationVoice signal input from either built-in microphoneMC3001 (EM-140) on the CNTL-UNIT or external jackJ2002 on the AF-U

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